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TN12, TS12 and TYNx12 Series
Sensitive and Standard 12 A SCRS
Main features
Symbol IT(RMS) VDRM/VRRM IGT Value 12 600 to 1000 0.2 to 15 Unit A
A
G K A
A
V mA
KA G KA G
DPAK (TN12-B / TS12-B)
D2PAK (TN12-G)
A
Description
Available either in sensitive (TS12) or standard (TN12 / TYN) gate triggering levels, the 12 A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits. Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area.
A
K
A
K G
A G
IPAK (TN12-H / TS12-H)
TO-220AB (TYNx12RG)
Order codes
Part Numbers TN1215-X00B TN1215-X00B-TR TN1215-x00G TN1215-x00G-TR TN1215-x00H TS1220-x00B TS1220-x00B-TR TS1220-x00H TYNx12RG TYNx12TRG Marking TN1215x00 TN1215x00 TN1215x00G TN1215x00G TN1215x00 TS1220x00 TS1220x00 TS1220x00 TYNx12 TYNx12T
March 2007
Rev 6
1/12
www.st.com 12
Characteristics
TN12, TS12 and TYNx12 Series
1
Table 1.
Symbol
Characteristics
Absolute ratings (limiting values)
Value Parameter TN12-G TYN12 Tc = 105 C Tc = 105 C 145 Tj = 25 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 125 C 140 98 50 4 1 - 40 to + 150 - 40 to + 125 5 12 8 115 A 110 60 A2S A/s A W C V TN12-B/H TS12-B/H Unit
IT(RMS) IT(AV) ITSM It dI/dt IGM PG(AV) Tstg Tj VRGM
RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 8.3 ms tp = 10 ms tp = 10 ms F = 60 Hz tp = 20 s
A A
Maximum peak reverse gate voltage (for TN12 and TYN12 only)
Table 2.
Symbol IGT VGT VGD VRG IH IL dV/dt VTM Vt0 Rd IDRM IRRM
Sentitive electrical characteristics (Tj = 25 C, unless otherwise specified)
Test Conditions VD = 12 V VD = VDRM IRG = 10 A IT = 50 mA IG = 1 mA RGK = 1 k RGK = 1 k RGK = 220 Tj = 125 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 25 C Tj = 125 C RL = 140 RL = 3.3 k RGK = 220 Tj = 125 C MAX. MAX. MIN. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 2 mA TS1220 200 0.8 0.1 8 5 6 5 1.6 0.85 30 5 Unit A V V V mA mA V/s V V m A
VD = 65 % VDRM ITM = 24 A
tp = 380 s
Threshold voltage Dynamic resistance VDRM = VRRM RGK = 220
2/12
TN12, TS12 and TYNx12 Series Table 3.
Symbol
Characteristics
Standard electrical characteristics (Tj = 25 C, unless otherwise specified)
TN1215 Test Conditions B/H MIN. 2 15 1.3 0.2 40 80 200 1.6 0.85 30 5 MAX. 2 mA 30 60 15 30 40 30 60 200 G x12T 0.5 5 x12 2 mA MAX. MAX. VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM ITM = 24 A Gate open Tj =125 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 25 C Tj = 125 C RL = 3.3 k Gate open Tj = 125 C MIN. MAX. MAX. MIN. MAX. MAX. MAX. 15 V V mA mA V/s V V m A TYN Unit
IGT VGT VGD IH IL dV/dt VTM Vt0 Rd IDRM IRRM
VD = 12 V
RL = 33
tp = 380 s
Threshold voltage Dynamic resistance VDRM = VRRM
Table 4.
Symbol Rth(j-c)
Thermal resistance
Parameter Junction to case (DC) S
(1)
Value 1.3
Unit C/W
= 0.5
cm
DPAK D2PAK IPAK TO-220AB
70 45 C/W 100 60
S(1) = 1 cm Rth(j-a) Junction to ambient (DC)
1. S = Copper surface under tab
Figure 1.
Maximum average power Figure 2. dissipation versus average on-state current
IT(AV)(A)
14
Average and D.C. on-state current versus case temperature
P(W)
12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7
360
= 180
D.C.
12 10
= 180
8 6 4 2
IT(AV)(A)
8 9
Tcase(C)
0 0 25 50 75 100 125
3/12
Characteristics
TN12, TS12 and TYNx12 Series
Figure 3.
Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK)
Figure 4.
Relative variation of thermal impedance junction to case versus pulse duration
IT(AV)(A)
3.0 2.5
D.C.
K=[Zth(j-c)/Rth(j-c)]
1.0
2.0 1.5
= 180
D2PAK
0.5
1.0 0.5
DPAK
0.2
Tamb(C)
0.0 0 25 50 75 100 125
tp(s)
0.1 1E-3 1E-2 1E-1 1E+0
Figure 5.
Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK)
2.0 1.8 1.6
DPAK
Relative variation of gate trigger current and holding current versus junction temperature for TS12 series
K=[Zth(j-a)/Rth(j-a)]
1.00
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C]
IGT
1.4
D2PAK
1.2
TO-220AB / IPAK
0.10
1.0 0.8 0.6 0.4
IH & IL RGK = 1k
tp(s)
0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.2 0.0 -40 -20 0 20
Tj(C)
40 60 80 100 120 140
Figure 7.
Figure 8. Relative variation of gate trigger current and holding current versus junction temperature for TN12 and TYNx12 series
5.0
Relative variation of holding current versus gate-cathode resistance (typical values) for TS12 series
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C]
2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 120 140
IH & IL IGT
IH[RGK] / IH[RGK=1k]
Tj = 25C
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0
Tj(C)
0.5 0.0 1E-2 1E-1
RGK(k)
1E+0 1E+1
4/12
TN12, TS12 and TYNx12 Series
Characteristics
Figure 9.
Relative variation of dV/dt immunity Figure 10. Relative variation of dV/dt immunity versus gate-cathode resistance versus gate-cathode capacitance (typical values) for TS12 series (typical values) for TS12 series
dV/dt[CGK] / dV/dt[RGK=220]
4.0
Tj = 125C VD = 0.67 x VDRM
dV/dt[RGK] / dV/dt[RGK=220]
10.0
3.5 3.0 2.5
VD = 0.67 x VDRM Tj = 125C RGK = 220
1.0
2.0 1.5 1.0
RGK(k)
0.1 0 200 400 600 800 1000 1200
0.5 0.0 0 25 50
CGK(nF)
75 100 125 150
Figure 11. Surge peak on-state current versus Figure 12. Non-repetitive surge peak on-state number of cycles current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of It
ITSM(A)
150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 1
2000
Tj initial = 25C
ITSM(A), I2t (A2s)
1000
TN12 / TYN12 Non repetitive Tj initial=25C tp=10ms One cycle dI/dt limitation TS12 TN12 / TYN12 ITSM
TS12
100
I2t
TN12 / TYN12
TS12 Repetitive TC=105C
Number of cycles
10
tp(ms)
0.01 0.10 1.00 10.00
10
100
1000
Figure 13. On-state characteristics (maximum Figure 14. Thermal resistance junction to values) ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35 m) (DPAK and D2PAK)
ITM(A)
200 100
Tj max.: Vt0=0.85V Rd=30m
Rth(j-a)(C/W)
100
80
60
Tj=max DPAK
10
Tj=25C
40
D2PAK
20
VTM(V)
1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0 0 2 4 6 8
S(cm)
10 12 14 16 18 20
5/12
Ordering information scheme
TN12, TS12 and TYNx12 Series
2
Ordering information scheme
Figure 15. TN12 series
TN 12 15 - 600 B (-TR)
Standard SCR series Current 12 = 12 A Sensitivity 15 = 15 mA Voltage 600 = 600 V 800 = 800 V 1000 = 1000 V Package B = DPAK G = D2PAK H = IPAK Packing mode Blanck = Tube -TR = Tape and Reel (DPAK and D2PAK)
Figure 16. TS12 series
TS 12 20 - 600 B (-TR)
Sensitive SCR series Current 12 = 12 A Sensitivity 20 = 200 A Voltage 600 = 600 V 700 = 700 V Package B = DPAK H = IPAK Packing mode Blanck = Tube -TR = Tape and Reel
Figure 17. TYNx12 series
TYN
Standard SCR series Voltage 6 = 600 V 8 = 800 V 10 = 1000 V Current 12 = 12 A Sensitivity Blanck = 15 mA T = 5 mA Packing mode RG = Tube
6
12
T
RG
6/12
TN12, TS12 and TYNx12 Series Table 5. Product selector
Voltage (xxx) Part Numbers 600 V TN1215-xxxB TN1215-xxxG TN1215-xxxH TS1220-xxxB TS1220-xxxH TYNx12 TYNx12T X X X X X X X X X X X X 700 V 800 V X X X 1000 V
Package information
Sensitivity 15 mA 15 mA 15 mA 0.2 mA 0.2 mA 15 mA 5 mA
Package DPAK D2PAK IPAK DPAK IPAK TO-220AB TO-220AB
3
Package information
Epoxy meets UL94, V0 TO-220AB dimensions
Dimensions Ref. Millimeters Min. A
B OI L F A I4 l3 a1 l2 c2 b2 C
Table 6.
Inches Min. Typ. Max. 0.625 0.147
Typ.
Max.
15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75
15.90 0.598
a1 a2 B b1 b2 C c1 c2
14.00 0.511 10.40 0.393 0.88 0.024 1.32 0.048 4.60 0.173 0.70 0.019 2.72 0.094 2.70 0.094 6.60 0.244 3.85 0.147
0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151
a2
e F
M
b1 e
c1
OI I4 L l2 l3 M
15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 0.104 1.70 0.044 1.70 0.044 0.102 0.116 0.066 0.066
7/12
Package information Table 7. IPAK dimensions
TN12, TS12 and TYNx12 Series
Dimensions Ref. Millimeters Min. A A1 A3
A E B2 L2 C2
Inches Min. Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.035
Typ.
Max.
2.20 0.90 0.70 0.64 5.20
2.40 0.086 1.10 0.035 1.30 0.027 0.90 0.025 5.40 0.204 0.95 0.30
B B2 B3 B5
D
C C2
0.45 0.48 6 6.40 2.28 4.40 16.10 9 0.8 0.80 10
0.60 0.017 0.60 0.019 6.20 0.236 6.60 0.252 0.090 4.60 0.173 0.634 9.40 0.354 1.20 0.031 1
0.023 0.023 0.244 0.260
H L
L1
B3 B V1 A1
D E e
C A3
e G
B5
G H L L1 L2 V1
0.181
0.370 0.047 0.031 0.039 10
8/12
TN12, TS12 and TYNx12 Series Table 8. DPAK dimensions
Package information
Dimensions Ref. Millimeters Min. A
E B2 C2 L2 A
Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
A1 A2 B B2
D
H L4 B G A1
R
C C2
R C
D E
A2 0.60 MIN.
G H
V2
L2 L4 V2
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
Figure 18. DPAK footprint dimensions (in millimeters)
6.7 3 3 1.6
2.3 6.7 2.3
1.6
9/12
Package information Table 9. D2PAK dimensions
TN12, TS12 and TYNx12 Series
Dimensions Ref. Millimeters Min. A
A E L2 C2
Inches Min. 0.169 0.098 0.001 0.027 0.048 0.055 Typ. Max. 0.181 0.106 0.009 0.037
Typ.
Max. 4.60 2.69 0.23 0.93
4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0 1.40
A1 A2 B
D
L L3 A1
B2 C C2
0.60 1.36 9.35
0.017 0.047 0.352
0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016
B2 B G
C
R
D E
10.28 0.393 5.28 0.192
A2 2mm min. FLAT ZONE
G L
V2
15.85 0.590 1.40 1.75 0.050 0.055
L2 L3 R V2
8
0
8
Figure 19. D2PAK footprint dimensions (in millimeters)
16.90
10.30 1.30
5.08
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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TN12, TS12 and TYNx12 Series
Ordering information
4
Ordering information
Ordering type(1) TN1215-X00B TN1215-X00B-TR TN1215-x00G TN1215-x00G-TR TN1215-x00H TS1220-x00B TS1220-x00B-TR TS1220-x00H TYNx12RG TYNx12TRG Marking(1) TN1215x00 TN1215x00 TN1215x00G TN1215x00G TN1215x00 TS1220x00 TS1220x00 TS1220x00 TYNx12 TYNx12T Package DPAK DPAK D2PAK D PAK IPAK DPAK DPAK IPAK TO-220AB TO-220AB
2
Weight 0.3 g 0.3 g 1.5 g 1.5 g 0.3 g 0.3 g 0.3 g 0.3 g 2.3 g 2.3 g
Base qty Delivery mode 75 2500 50 1000 75 75 2500 75 50 50 Tube Tape and reel Tube Tape and reel Tube Tube Tape and reel Tube Tube Tube
1. x (6, 7, 8, 10) depends upon voltage
5
Revision history
Date Sep-2000 25-Mar-2005 14-Oct-2005 Revision 3 4 5 Last update. TO-220AB delivery mode changed from bulk to tube. Changed sensitivity values in Table 5 for TYNx12 (30 to 15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK statement. Reformatted to current standard. Figure 15: TN12 series product name corrected. Figure 16: TS12 series product name corrected. Description of Changes
08-Mar-2007
6
11/12
TN12, TS12 and TYNx12 Series
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